High Speed has never been more flexible

Our Sliver internal cabled interconnect system can provide a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. With a 0.6mm contact pitch, Sliver products are super slim, allowing you to fit more inside the box. In addition to card-edge configurations, we provide a highly robust metal housing design on the connector cage to help withstand cable pull while an active latch provides additional connection security. This new connectivity technology simplifies design and helps lower overall costs by eliminating the need for re-timers and more costly lower-loss PCB materials while reaching speeds up to 56 Gbps with the use of TE high speed cable.

Silver for SFF-TA-1002

TE Connectivity (TE) sliver interconnects for SFF-TA-1002 are flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. With a 0.6mm contact pitch, sliver products are super slim, allowing you to fit more inside the box. In addition to card-edge configurations, we provide a highly robust metal housing design on the connector cage to help withstand cable pull while an active latch provides additional connection security.

Features & Benefits:

Sliver for SFF-TA-1002

  • Sliver connector adopted into SFF-TA-1002 and sliver cables into SFF-TA-1020, due to the portfolio’s performance, density, flexibility, and robustness. Large portfolio of options supports modularity and current trends in marketplace.
  • Robust ecosystem- Sliver SFF-TA-1002/1020 are adopted by various industry standards including EDSFF, PECFF, OCP NIC, DC-XPI.
  • Meets all current protocol performance requirements for PCIe Gen 3/4 (8G and 16G), SAS 3/4 (6G, 12G and 24G), ethernet protocols (10G and 25G per lane), InfiniBand (28G), EDSFF, PECFF, and meets performance for IEEE and IOF 56 GBPS, PCIe Gen 5 and SAS. 
  • Rated up to 56G PAM-4 (112G) speeds with PCIe Gen 6 and beyond capability.
  • Sizing Options include 1C (x4), 2C (x8) and 4C/4C+ (x16) in both right angle, and vertical sizes. All module cards can plug into any alternative configuration by design. Non-standard variants are also available in x32 and x16 + high power.

 

Silver SFF TA
  1. Sliver Connectors for SFF-TA-1002 Video (English)

Learn more about TE's Sliver connectors for the SFF-TA-1002 specification and how they can support ease of design-in and multi-sourcing in our universal internal connection interface for server and storage devices. Discover how Sliver can in advanced storage applications.

Features & Benefits:

  • 0.6mm contact pitch
  • Receptacle includes robust metal shell with cable latching
  • Vertical and right angle receptacle options accepts Sliver cable assemblies or PCB plug-in cards
  • Cable assemblies incorporate our high-speed, low-loss 33 AWG cable and can support both 85 and 100 Ohm environments
  • 12G and 25G options provide economic solutions for a variety of applications

 

Multiple Protocols Supported

Integrating protocols and high speed flexibility

Equipment designs using various standard and custom signal protocols are broadly adopting mid-board copper connectivity technology.

Protocols supported by Sliver include, but are not limited to:

  • PCIe Gen3/4 (8G & 16G)
  • SAS-3/4 (6G, 12G, & 24G)
  • Ethernet protocols (10G & 25G per lane)
  • Infiniband (28G)
  • Custom protocols (up to ~32G per lane)
  1. Sliver Internal Cabled Interconnects (English)

Designed to be one of the most flexible solutions on the market for making internal I/O connections on the board, TE’s Sliver product portfolio is a robust connector and cable assembly system that helps extend the reach for high data signals inside networking equipment from the microprocessors to other locations while maintaining optimal signal integrity.

Application Options

Open up your design options and extend your reach with Sliver for a wide range of applications including the following:

  • Chip-to-chip
  • Board-to-Board
  • Chip to front panel I/O
  • High speed card edge
Sliver chip to chip
Chip to chip within a server with detachable interface (e.g. Sliver to Sliver with standard or custom protocol).
Sliver board-to-board
Board-to-board within a server or storage device (e.g. Sliver to Sliver or Sliver to standard PCIe or SAS).
Sliver chip to front panel I/O
Chip to front panel I/O within a server, router or switch (e.g. Sliver to Sliver or Sliver to custom cable & connectors).
Sliver card edge
High-speed card edge within a server or storage device (e.g. Sliver high density 25G or x16 PCIe interface).

Sliver is scalable

Extends in increments of 8 differential pairs (DP)

  • 16DP (50 pin)
  • 24DP (74 pin)
  • 32DP (100 pin) [Proposed]
  • 40DP (124 pin)
  • 48DP (148 pin) card edge only
Sliver

Sliver Interconnects: one solution enables multiple new designs including 1) mid-board cable applications, 2) backplane/mid-plane applications, 3) low-profile PCIe add-in card applications, 4) vertical card edge applications, and 5) horizontal card edge applications.