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Automotive
The Next Generation of Mobility
Next-generation mobility will be defined by safer, more sustainable and convenient ways of moving around. Download the trend paper to learn more.
TE has developed a green, Sn-free, Bismuth (Bi)-based plating technology to provide electronics manufacturers with a comprehensive tin-whisker prevention solution.
Our vision is to co-create end-to-end automotive data connectivity and sensor solutions that are true enablers of autonomous driving. Download our trend paper to learn more.
A 18-member team from the University of Michigan, sponsored in part by TE Connectivity (TE), has finished second in the Bridgestone World Solar Challenge, an 1,800 mile race across the Australian Outback that many of the students involved called the adventure of a lifetime.
Proper crimp tooling design, based on bottoming dies, is essential to consistent crimping that meets specifications required in today’s market.
When a connector design engineer develops a crimp, there are several factors that need to be considered, i.e. wire size, electrical and mechanical properties.
Defining key characteristics of crimp tooling and the effects those characteristics may have in the production process.
Developed to perform reliably in the increasingly harsh environments demanded by modern high-performance combustion engines.
TE’s new bismuth-based solution for press-fit applications can reduce the risk of whisker growth by a factor of over 1600 compared to traditional tin technology. Learn more and view our whitepaper.
TE's MATEnet interconnection system offers reliability, affordability, fully automated handling, quality level, miniaturization, light-weighting, flexibility, and scalability to support economic car connectivity via automotive Ethernet. Learn more and view our whitepaper.
The development goal of the MCON 8 contact system was to construct a particularly rugged and reliable product using the prescribed cavity, at the same time implementing innovative design features characteristic of an efficient TE contact system.
Experience TE's whitepaper on miniaturized automotive coax terminals featuring our MATE-AX coaxial interconnection system, an automotive-grade RF interconnection solution for 9 GHz and above in multiple pin count applications.
TE's miniaturized strategies and solutions support weight reduction in vehicles by less packaging space. Learn more in our whitepaper.
TE’s NanoMQS terminals enable a reduced PCB size for electronic components, smaller wires and a reduced total connector package.
