3-100669-0
Hard Metric Backplane PCB Mount Header, ≤1 Gb/s, 25 Column, 7 Row, Mezzanine, 175 Position, 2 mm [.078 in] Centerline, Vertical, Gray, Z-PACK 2mm HM
3-100669-0
Hard Metric Backplane PCB Mount Header, ≤1 Gb/s, 25 Column, 7 Row, Mezzanine, 175 Position, 2 mm [.078 in] Centerline, Vertical, Gray, Z-PACK 2mm HM
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- Z-PACK
- Z-PACK 2mm HM
- TE Internal #: 3-100669-0
- TE Internal Description: 2MM HM TYPE B PIN ASSEMBLY
- All Hard Metric Male Connector: Traditional Backplane, Mezzanine, 2mm (124)
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PCB Connector Assembly Type : PCB Mount Header
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Data Rate (Gb/s): ≤1
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Number of Columns : 25
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Number of Rows : 7
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Backplane Architecture : Mezzanine
Documents
Product Drawings
- MALE ASSEMBLY, Z-PACK 2mm HM, TYPE B ENG_CD_100669_R.pdf English
CAD Files
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Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
- 3D PDF 3D_CVM_CVM_3-100669-0_K.pdf 3D
- Customer View Model ENG_CVM_CVM_3-100669-0_K.2d_dxf.zip English
- ENG_CVM_CVM_3-100669-0_K.3d_igs.zip English
- ENG_CVM_CVM_3-100669-0_K.3d_stp.zip English
Product Specifications
- Application Specification ENG_SS_114-19029_E.pdf English
- Product Specification ENG_SS_108-19082_C.pdf English
