Interconnect system of wire and cable connectors
AMPMODU interconnect system is a comprehensive family of modular signal interconnects for board-to-board, wire-to-board, and wire-to-wire applications from 1.00 mm (0.039”) to 3.96 mm (0.156”) centerlines that are widely used across nearly all industrial applications requiring Printed Circuit Boards (PCBs).
Miniaturization is a trend impacting industries globally. The breadth of AMPMODU components, combined with its small size make it a solid interconnect system for a wide range of applications and systems. The growing need for board miniaturization is driving demand towards fine pitch connectors. It is designed to reliably and economically meet a variety of packaging and interconnection requirements. The large variety of components and application possibilities, combined with a small, compact footprint enables space savings and high quality design. This makes the AMPMODU interconnect products suitable for applications and systems across a broad range of industries.
Scroll down to learn more about our AMPMODU Interconnect System, available in 1, 1.27, 2, 2.54 and 3.96 mm pitch.
Features
- Modular concept, utilizing precision formed receptacle contacts and mating posts that ensures interchangeable solutions for flexible design
- Design flexibility through a comprehensive portfolio of single and double row options for board-to-board, wire-to-board, and wire-to-wire applications with TE designed application tooling
- Economic and compact design allows for PCB space savings
- Multiple solder tail lengths available to accomodate different PCB thicknesses
- Available in most mounting geometries, plating types, and packaging styles to offer flexible manufacturing options and meet cost requirements for customers
- Dual-beam contacts provides reliable signal transfers in high vibration environments
- Most connectors meet industry environmental, health, and safety requirements (RoHS, REACH, and UL)
- Connector housings available in high-temp resin compatible with reflow solder processes, saving customers time and money
Two integral cantilever beams contact the mating posts providing reliable signal transfers. Deflection of these spring members is limited by anti-overstress stops, and excessive permanent deformation is prevented. This feature allows a wide range for tolerance of misalignment of mating contacts. The dual-beam contacts prevent connection loss in high vibration environments. The AMPMODU mating post tip design is carefully chosen to minimize stubbing and scratching, which supports high durability of the AMPMODU product family.
Design Navigator
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Design Navigator - Board Signal Interconnects
Use our board signal design navigator to find the right product for your next design.
Miniaturization is a trend impacting industries globally. The growing need for board miniaturization is driving demand towards fine pitch connectors. Join TE Connectivity Product Managers, Jana New and Sameer Trikha, in this webinar to learn more about global miniaturization trends and AMPMODU board connectivity product solutions. The breadth of AMPMODU components, combined with its small size make it the ideal interconnect system for a wide range of applications and systems.
1 mm Pitch
AMPMODU 1 MM Small Centerline
AMPMODU Small Centerline is a family of board-to-board fine-pitch connectors with a .050" x .050" (1.00 mm x 1.00 mm) centerline. To serve a broad range of design requirements, the portfolio offers up to 100 positions with 2 plating options and supports automated surface mounting and reflow processes.
Tape & Reel packaging: The existing product portfolio of Small Centerline products is now extended with Tape & Reel packaging. New Tape & Reel packaging allows further automation of assembly and enables placement of connectors onto the board in automated assembly with pick and place caps.
Features
- 85% space savings on PCB with 1.0 mm centerline as compared to2.54 mm [0.100”] connectors
- Reliable signal transfers through two points of contact even in severe shock/vibration applications
- Manufacturing flexibility in an automated environment with surface mount configuration with pick and place cap
- Improved durability and corrosion resistance with gold plating
- Time savings thanks to reflow-capable materials
- Greater flexibility in the assembly of boards with dual entry receptacles
1.27 mm Pitch
AMPMODU 50/50 GRID Connectors
AMPMODU 50/50 Grid connectors include a variety of high density board-to-board and wire-to-board connectors with a .050" x .050" (1,27 mm x 1,27 mm) pitch.
Features
- Available in double row, vertical or right angle, shrouded, from 10 up to 100 positions.
- Mechanical hold downs to aid in solder processing.
- Three available board stack heights offer flexibility in mezzanine application architecture.
- Polarized housings prevent incorrect mating.
- Positive latch assures secure connector locking & functionality in high vibration environments.
- Stand-offs on housings allow easy removal of solder.
AMPMODU SYSTEM 50 connectors
AMPMODU System 50 connectors include a wide variety of high density board-to-board (thru-hole and surface-mount) and wire-to-board connectors, composed of one- and two-row receptacles and post headers with a .050" x .100" [1.27 mm x 2.54 mm] pitch.
Features
- Available in ribbon cable or Flat Flexible Cable (FFC) termination where ribbon cable connectors saves board space and significantly reduces problems of latch height compatibility.
- Polarized housing helps prevent incorrect mating.
- Shrouded housings add user safety and contact protection.
- Positive latch ensures secure cable connector mating even in harsh vibration environments.
- Stand-offs on housings allow easy removal of solder.
- Non-protrusive hold-downs provide retention during soldering & long-term strain relief for solder joints.
- High-temp board-mount housings are reflow capable, saving time and money through shared manufacturing processes.
2 MM PITCH
AMPMODU 2 mm connectors
AMPMODU 2 mm connectors include breakaway headers, shrouded headers and board-mount and wire receptacles with a .079" x .079" (2 mm x 2 mm) pitch, occupying 38 percent less space than traditional .100" (2.54 mm) centerline products. These connectors support automated surface-mount, through-hole reflow (Pin-in-Paste), and traditional through-hole mount processes for ease of manufacturing.
Features
Headers
- Intermateable solution with major brand receptacles.
- Connector Size: 2-25 positions per row, available in single and double row.
- PCB Thickness: 1.6 mm to 2.4 mm.
- High-temp housings are reflow capable, saving time and money through shared manufacturing processes.
- Polarization feature on shrouded header housings prevents incorrect mating and protects contacts.
- Detent latching helps prevent un-mating in vibration environments.
Features
Receptacles
- Top and dual entry vertical and horizontal receptacle assemblies.
- Surface-mount and through-hole with multiple solder tail lengths for various PCB thickness, 1.6 mm to 2.4 mm.
- Up to 25 positions per row, single and dual row offering.
- Board-mount housings are made from high-temp resin making them reflow solderable.
- Detent latching helps prevent un-mating in vibration environments.
TE Connectivity (TE)’s new AMPMODU 2 mm offerings are suitable for use in high-vibration environments and in applications where space is at a premium, including PLC and other I/O devices, servo drives, industrial robotics, industrial controls, material handling equipment, instrumentation and test equipment, and building and home automation devices. Combined, these compact solutions provide valuable space savings on printed circuit boards (PCBs) to enable extended functionality for today's miniaturized electronics.
This connector system supports efficient and cost-effective application onboards with automated surface mounting and through-hole-reflow manufacturing.
Built for wire-to-board and board-to-board connections, the AMPMODU 2mm connector system meets miniaturization demands for factory automation and industrial robotics applications. Designed for a variety of mating needs, the 2 mm solution occupies 38% less space on a circuit board than traditional connectors.
2.54 mm Pitch
AMPMODU MTE Connectors
AMPMODU MTE connectors include wire-to-board and wire-to-wire connectors with a .100" (2.54 mm) pitch. Coupling shrouds permit ganging of receptacle assemblies for dual-row configurations. They are available in IDC and crimp termination types while their latching capability provides positive retention between housings.
Features
- Swage option on posts provide retention in PC board.
- High temperature option is SMT compatible to 265 degree wave.
- Positive latch ensures secure cable connector mating even in harsh vibration environments.
- Polarized housings prevent incorrect mating.
- Coupling shroud permits ganging of smaller connectors into a larger single row or double row latching solution.
- Available in three platings.
AMPMODU Mod IV V connectors
AMPMODU Mod IV V connectors include a variety of rugged and reliable wire-to-board connectors on a modular .100" x .100" (2.54 x 2.54 mm) centerline configuration.
Features
- Mate to AMPMODU breakaway, shrouded & unshrouded headers with a .025" (0.64 mm) square post.
- Polarization and strain relief features.
- Keying plugs available.
- Three contact pressure options available for different levels of vibration environments.
AMPMODU Headers
AMPMODU Headers provide a wide variety of rugged and reliable .100" x .100" (2.54 x 2.54 mm) centerline configurations utilizing .025” square posts.
Features
- Available in standard unshrouded, breakaway, reeled breakaway, shrouded, action pin, and stacking types.
- Pin Protection.
- Flexibility in Board Architecture.
3.96 mm Pitch
AMPMODU MOD I Connectors
AMPMODU MOD I connectors include a variety of board-to-board and wire-to-board connectors with a .156" x .156" (3.96 mm x 3.96 mm) pitch.
Features
- 85% space savings on the board when compared to standard 2.54 mm pitch products
- Available in double row, surface mount termination, from 10 to 100 positions
- Dual-entry receptacle offers greater flexibility in board assembly
- Caps available on all parts for automated equipment placement on boards
Frequently Asked Questions (FAQs)
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Browse our AMPMODU Interconnect System FAQ page to find answers to common technical questions around designing in AMPMODU connectors
