Application
Network Storage
TE has storage connectivity solutions that address the growing wireless communications demand.
As the Internet of Things (IoT) expands and the growing connected world generates exponentially more data, efficient and reliable storage solutions become even more critical across the wireless and communications infrastucture. Whether you are designing to scale up or scale out with your data center storage solutions, TE has a broad range of input/output (I/O), board-to-board, power products and more to help you achieve your storage performance objectives. TE combines innovation and quality, dependable products with the flexibility to deliver storage interconnect solutions practically anywhere in the world. TE is your partner for creating the solutions that meet the demand of the next generation of our data-driven world.
Surface Mount Resistors
A surface mount resistor is a tiny rectangular ceramic body with silver conductive edges on either end. They provide the same functionality as the more traditional axially leaded resistors but has a lower power dissipation capacity and oftentimes a lower stray inductance and capacity.
Memory and Sockets
We have a range of solderless, compression-mount socketing solutions and the latest in memory connectors.
Through-Hole Resistors
A through-hole resistor is a fixed resistor that has long, pliable leads that can be stuck into a breadboard or hand- or wave-soldered into a printed circuit board. A through-hole resistor is used to reduce the flow of electrical current within a circuit. It’s commonly composed of carbon film, metal film, metal oxide film, thick film, or wirewound.
Power Connectors
Robust and reliable bus bar, cable, hot-pluggable and blind mating solutions for critical storage applications including our MULTI-BEAM XLE Connectors.
High Speed Backplane
Transfer data at speeds of 25 Gbps with scalability up to 56 Gbps—upgrade without costly backplane redesigns.
QSFP Interconnect Portfolio
Built to meet your requirements for today and tomorrow, our QSFP/QSFP+ and zQSFP+ interconnects offer data rates up to 28 Gbps in an industry standard, scalable design.
Tactile Switches
Tactile switches provide tactile feedback to the user when the switch or button makes contact with the control panel underneath, which is usually a printed circuit board.
DIP and SIP Switches
A DIP switch is a manual electronic package that is composed of a series of tiny switches. It has a rectangular casing and two parallel rows of connecting terminals. A SIP switch is a computer chip package that has a single row of connection pins.
LGA Sockets
Land grid array (LGA) sockets provide compressive electrical interconnect between the processor and the printed circuit boards (PCBs). As computing power increases, so does the chips' pin counts. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection.
TE continues to be engaged in the latest storage interface standards to support the ever evolving market and its continual need for higher bandwidth. With the technical expertise required to deliver superior designs and customer support, TE offers solutions to virtually any storage challenge.
Application
Network Storage
TE has storage connectivity solutions that address the growing wireless communications demand.
As the Internet of Things (IoT) expands and the growing connected world generates exponentially more data, efficient and reliable storage solutions become even more critical across the wireless and communications infrastucture. Whether you are designing to scale up or scale out with your data center storage solutions, TE has a broad range of input/output (I/O), board-to-board, power products and more to help you achieve your storage performance objectives. TE combines innovation and quality, dependable products with the flexibility to deliver storage interconnect solutions practically anywhere in the world. TE is your partner for creating the solutions that meet the demand of the next generation of our data-driven world.
Surface Mount Resistors
A surface mount resistor is a tiny rectangular ceramic body with silver conductive edges on either end. They provide the same functionality as the more traditional axially leaded resistors but has a lower power dissipation capacity and oftentimes a lower stray inductance and capacity.
Memory and Sockets
We have a range of solderless, compression-mount socketing solutions and the latest in memory connectors.
Through-Hole Resistors
A through-hole resistor is a fixed resistor that has long, pliable leads that can be stuck into a breadboard or hand- or wave-soldered into a printed circuit board. A through-hole resistor is used to reduce the flow of electrical current within a circuit. It’s commonly composed of carbon film, metal film, metal oxide film, thick film, or wirewound.
Power Connectors
Robust and reliable bus bar, cable, hot-pluggable and blind mating solutions for critical storage applications including our MULTI-BEAM XLE Connectors.
High Speed Backplane
Transfer data at speeds of 25 Gbps with scalability up to 56 Gbps—upgrade without costly backplane redesigns.
QSFP Interconnect Portfolio
Built to meet your requirements for today and tomorrow, our QSFP/QSFP+ and zQSFP+ interconnects offer data rates up to 28 Gbps in an industry standard, scalable design.
Tactile Switches
Tactile switches provide tactile feedback to the user when the switch or button makes contact with the control panel underneath, which is usually a printed circuit board.
DIP and SIP Switches
A DIP switch is a manual electronic package that is composed of a series of tiny switches. It has a rectangular casing and two parallel rows of connecting terminals. A SIP switch is a computer chip package that has a single row of connection pins.
LGA Sockets
Land grid array (LGA) sockets provide compressive electrical interconnect between the processor and the printed circuit boards (PCBs). As computing power increases, so does the chips' pin counts. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection.
TE continues to be engaged in the latest storage interface standards to support the ever evolving market and its continual need for higher bandwidth. With the technical expertise required to deliver superior designs and customer support, TE offers solutions to virtually any storage challenge.
