Power Solutions
Application
Open Compute Project (OCP) Solutions
TE Connectivity (TE) offers solutions, including our latest innovations around cabled backplane, high-speed cables, and liquid and thermal cooling, to enable our customers to build the next generation of AI systems.
The advent of the AI/ML era is driving a major revolution in scale, complexity, and time-to-market of compute architectures at both the data center and at the edge. Interconnect solutions are more critical than ever in providing low-latency GPU-to-GPU clustering and connectivity; memory pooling and disaggregation; and efficient thermal management. TE's OCP solutions are helping our customers build the next generation of AI systems.
Modular Extensible I/O Connectors & Cable Assemblies for OCP DC-MHS
TE Connectivity (TE) has rich experience in designing high-speed and high-power connectors and cable assemblies that enable us to expand our product portfolio to offer connectors compliant with the SFF-TA-1033 specification and the OCP DC-MHS (Data Center – Modular Hardware System) M-XIO base specification.
Active Optics Cable Assemblies
Our Active Optical Cable assembly portfolio provides greater cable flexibility and longer reach, as compared to both traditional passive copper solutions and emerging Active Copper Cables & Active Electrical Cables (ACC/AEC) solutions, supporting high performance computing, data center and networking interconnect applications.
Sliver Internal Cabled Interconnects
Our Sliver internal cabled interconnect system can provide a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs.
CDFP Connectors, Cages & Cable Assemblies
Our CDFP technology enables a x16 link width within a single port and will be scalable to support x8 and x4 channels. As the industry upgrades from PCIe Gen 5 to PCIe Gen 6, the connector footprint migrates from press-fit to surface mount technology (SMT). We also offer the passive copper cable which is typically used for current hyperscale / cloud applications.
TE Expert Talks at OCP Global Summit 2024
Product Video & Demos
TE Connectivity’s (TE) power solutions portfolio for Data Centers and Artificial Intelligence (AI) applications provide simple, yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, all while offering improved electrical performance. These plug and play solutions support 48V architectures, while offering lower resistance and low milli-volt drop. TE Connectivity Data and Devices is your partner in designing power distribution systems to meet your needs.
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Sliver Connectors for SFF-TA-1002 Video (English)
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MULTI-BEAM Plus Power Connectors for Data Center Operations
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Mini-SAS High Density Connectors & Cable Assemblies (English)
Bus Bar and Cable Assemblies for OCP
Next-Gen PCIe Architectures With Cabled Riser Solutions
More Relevant Content
Application
Open Compute Project (OCP) Solutions
TE Connectivity (TE) offers solutions, including our latest innovations around cabled backplane, high-speed cables, and liquid and thermal cooling, to enable our customers to build the next generation of AI systems.
The advent of the AI/ML era is driving a major revolution in scale, complexity, and time-to-market of compute architectures at both the data center and at the edge. Interconnect solutions are more critical than ever in providing low-latency GPU-to-GPU clustering and connectivity; memory pooling and disaggregation; and efficient thermal management. TE's OCP solutions are helping our customers build the next generation of AI systems.
Modular Extensible I/O Connectors & Cable Assemblies for OCP DC-MHS
TE Connectivity (TE) has rich experience in designing high-speed and high-power connectors and cable assemblies that enable us to expand our product portfolio to offer connectors compliant with the SFF-TA-1033 specification and the OCP DC-MHS (Data Center – Modular Hardware System) M-XIO base specification.
Active Optics Cable Assemblies
Our Active Optical Cable assembly portfolio provides greater cable flexibility and longer reach, as compared to both traditional passive copper solutions and emerging Active Copper Cables & Active Electrical Cables (ACC/AEC) solutions, supporting high performance computing, data center and networking interconnect applications.
Sliver Internal Cabled Interconnects
Our Sliver internal cabled interconnect system can provide a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs.
CDFP Connectors, Cages & Cable Assemblies
Our CDFP technology enables a x16 link width within a single port and will be scalable to support x8 and x4 channels. As the industry upgrades from PCIe Gen 5 to PCIe Gen 6, the connector footprint migrates from press-fit to surface mount technology (SMT). We also offer the passive copper cable which is typically used for current hyperscale / cloud applications.
TE Expert Talks at OCP Global Summit 2024
Product Video & Demos
TE Connectivity’s (TE) power solutions portfolio for Data Centers and Artificial Intelligence (AI) applications provide simple, yet customizable designs that enable a standardized platform capable of efficiently distributing up to 500A of power per UL and CSA criteria, all while offering improved electrical performance. These plug and play solutions support 48V architectures, while offering lower resistance and low milli-volt drop. TE Connectivity Data and Devices is your partner in designing power distribution systems to meet your needs.
-
Sliver Connectors for SFF-TA-1002 Video (English)
-
MULTI-BEAM Plus Power Connectors for Data Center Operations
-
Mini-SAS High Density Connectors & Cable Assemblies (English)
Power Solutions
Bus Bar and Cable Assemblies for OCP
Next-Gen PCIe Architectures With Cabled Riser Solutions
More Relevant Content
