Miniaturization

Manufacturers want a high-reliable signal, high data, and high-power capabilities in the smallest possible package. To meet these demands, miniaturized components are critical — and they must deliver more performance and reliability than ever before. The increasing number of AGVs and AMRs used in automated warehouses and logistics is driving the general requirement for miniaturization in addition to the demand for improvements in power density, performance, and communication reliability. These vehicles are very compact and include several subsystems with electronics, which all have to fit into a very limited space. Both mobile solutions require numerous sensors for navigation, a battery and charging management system, and internal motors and electronics, resulting in the need for hundreds of components for operation and connectivity. In order for all of these technical solutions to meet more powerful application requirements, numerous technical hurdles must be overcome. Density is one key factor to help solve these challenges. It starts with board connectors, which fulfill the internal device power needs and the signal transmission. Since equipment manufacturers look for smaller solutions that can provide more high-speed connectivity and power, engineers are turning to new
technologies to help solve the challenges of maximizing power density in a miniaturized vehicle. To help meet the need for miniaturized components that combine reliable signal and data transmission with high power possibilities, TE Connectivity offers a broad portfolio of components. The following provides insight into the TE connector portfolio, which is highly specific and detailed and therefore fits the requirement of design freedom.

Miniaturization is not a new trend in the power supply world, but demand for miniaturized components is growing as operations look for ways to improve efficiency, reduce costs, and streamline warehouse operations. AGVs and AMRs are built on different platforms from small to large. They require scalable components that still provide the necessary power and connectivity across a wide range — often with even more functionality and better performance and reliability.

Engineers have worked for years to improve power density. The limits on power density depend on the specific product involved. In addition to material limitations and approbation specifications, there are physical limitations, such as contact technology and thickness to meet transmission requirements, clearance and creepage distances, printed circuit board (PCB) workability, and different
manufacturing options.

The material choice depends on air and creepage distances, with optimal contact technology realized using smaller future-ready board connectivity for reliable applications and robust environments. In AGVs and AMRs, high-volume loading, wireless data transmission for fleet control, and sensor/actuator supply all require power transmissions of more than 10 A. Precise movement of heavy weights with intelligent transactions in smaller vehicles is the trend. In this environment, temperature resistance, mechanical robustness, and electrical shielding functionality are critical. A good example is the impact of environmental influences on data and signal transmission and how shielding helps solve this problem. Higher data rates of several thousand megabits need a high transmission frequency. The higher the transmission frequency, the more susceptible the data connection is to interference. Shielding helps deliver reliable integrity, reflecting a successful example of engineering expertise.

As more components are miniaturized in automated warehouses, another challenge to keep in mind is the issue of maintenance and repairs. As parts become smaller and components become packaged more closely together, it can be difficult to access the connection or component that requires maintenance or repair inside AMRs and AGVs. One failed connector may require the disassembly of the entire warehouse system — and warehouses cannot afford any prolonged downtime for maintenance. Products are tested against standards generally applied when products are used in harsh environments. Engineer requirements are based on customer and market requirements, standards, and the physical demands of the materials and the environment. Sometimes customer requirements above the market standards (such as VW75174, formerly LV214 for automotive applications) are necessary. In those cases, higher expectations for robustness or material durability must be met to avoid failures. This makes it especially important for manufacturers to invest in miniaturized components that are not only high-performing but also extremely reliable and durable. Examples of TE solutions that meet these demands for industrial applications include ERNI MaxiBridge, MicroBridge, MiniBridge, and SMC connectors. Original equipment manufacturers (OEMs) can count on TE for product consistency, quality, precision, and reliability, and can depend on TE’s team of experts for engineering know-how and support.