1.27 mm board-to-board and wire-to-board solutions

AMPMODU 50/50 Grid connectors include a variety of high-density board-to-board and wire-to-board headers and receptacles with a .050" x .050" (1.27 mm x 1.27 mm) pitch centerline. With a 3.9 A max current rating, these connectors accept 28 - 20 AWG (0.32 - 0.81 mm) wire size in an Insulation Displacement Contact (IDC) termination style.

Features

3 header stack heights (.250”, .320” & .390”):

  • Accommodates 3 different mezzanine stack heights.

 

Positive latch:

  • Provides for reliable secure connector locking & functionality in high-vibe environments.

 

Polarization feature:

  • Helps protect contacts and reduces the chances of incorrect mating.

Non-protrusive hold-downs:

  • Allows surface mounting on both sides of board.
  • Provides retention during soldering & long-term strain relief for solder joints.

 

T&R packaging with caps available:

  • Compatible with robotic assemblies.

 

Stand-offs on housings:

  • Allows removal of solder flux.

Typical Applications

  • Industrial controls
  • Building and home automation devices
  • Servo drives
  • Programmable logic controllers (PLCs) and other I/O devices
  • Telecommunications equipment
  • Robotics
  • Instrumentation and test equipment
  • Medical equipment
PLC
Contact us to learn more about our Automation Controls solutions, get technical support and samples.