MiniMRP Avionics and Electronics Packaging
The modular avionics architecture, based on ARINC 836A standards, saves weight, reduces package size by up to 40%, and increases design flexibility over existing architectures. With increased computing power in a smaller package, the MiniMRP is the next generation of electronics packaging and avionics hardware, putting ever-increasing computing power into 40% smaller packages at lower costs. The ability to interconnect small-form-factor electronic devices, either directly or over a network, enables distributed systems that replace traditional centralized systems.
Product Features :
MiniMRP Avionics and Electronics Packaging
•40% reduced space
•Up to 60% weight savings
•Reduced complexity through common components
•Increased flexibility
•Easy installation and maintenance
•DEUTSCH DMC-M Series connectors are the preferred connector solution for MiniMRP modules
•Flexible modularity and industry standardization: ARINC 836A and EN4165 standards
Increased Computing Power in a Smaller Package
MiniMRP avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs.
Small Form Factor Devices
The ability to interconnect small-form-factor electronic devices, either directly or over a network, enables distributed systems that replace traditional centralized systems.
Distributed Architecture
With MiniMRP avionics, the big box in the avionics bay can be replaced with many small boxes distributed throughout the aircraft, helping to meet your SWaP reduction requirements.
Applications :
• Cabin systems in Commercial Aircraft
• Military Aircraft
• Helicopters
• Unmanned Vehicles
• Ground Defense Vehicles
• Space