OSFP Connectors & Cable Assemblies

 TE Connectivity’s (TE) next generation octal small form-factor pluggable 224G DAC/AEC/ACC portfolio offers industry standard operations at 1600 Gbps complying with IEEE 802.3df and IEEE 802.3ck. The OSFP specification is designed to support high density applications, up to 32 1.6T ports per 1RU and TE offers a wide variety of configurations to support a range of power levels and cooling solutions.  TE’s OSFP-224G product line is well suited for artificial intelligence (AI) and machine learning (ML) architectures. 

Key Benefits:

    OSFP 1.6T DAC (Passive Copper Cable)

1.  Industry Standard – Up to 1600 Gbps aggregate throughput, compliant to IEEE 802.3df.
2. High Density - Enables system designs with 32, 1.6T ports per 1RU.
   
3. Compatibility - Backwards compatible with OSFP 400/800G form factor.

      OSFP 1.6T AEC (Active Electrical Cable)

1. Industry Standard - Up to 1600 Gbps aggregate throughput, compliant to IEEE 802.3ck .
2. Low Power – Lower power compared to optics; targeting <20W per module.
3. Active cables optimized for heat dissipation and system airflow.

    OSFP 1.6T ACC (Active Copper Cable)

1. Industry Standard – Up to 1600 Gbps aggregate throughput, compliant to IEEE 802.3df specification.
2. Low Power/Low Latency – Extending the reach of copper with linear active amplification.
3. Increased Routability – Maintaining reach with fine copper wire.

TE’s new OSFP 112G cages and connectors add to the wide range of products in the existing OSFP product portfolio providing customers with an 8x112G interconnect solution to support data transfer in next generation high density data center and cloud computing.