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OSFP for Next-Gen Thermal Performance
TE’s Octal Small Form Factor Pluggable (OSFP) connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200 Gbps and up to 400 Gbps. These products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. By utilizing integrated thermal heatsink technology in the plug, OSFP products provide superior thermal performance and signal integrity needed to support 400G data rates. OSFP products offer high-port density and can fit up to 36 ports of an 8-lane interface in a 1RU switch form factor, aligning with current and next-generation silicon road maps.
OSFP-224G DAC and AEC
Featured Product
TE Connectivity’s (TE) next generation octal small form-factor pluggable 224G DAC/AEC/ACC portfolio offers industry standard operations at 1600 Gbps complying with IEEE 802.3df and IEEE 802.3ck. The OSFP specification is designed to support high density applications, up to 32 1.6T ports per 1RU and TE offers a wide variety of configurations to support a range of power levels and cooling solutions. TE’s OSFP-224G product line is well suited for artificial intelligence (AI) and machine learning (ML) architectures.
Key Benefits:
OSFP 1.6T DAC (Passive Copper Cable)
- Industry Standard – Up to 1600 Gbps aggregate throughput, compliant to IEEE 802.3df.
- High Density - Enables system designs with 32, 1.6T ports per 1RU.
- Compatibility - Backwards compatible with OSFP 400/800G form factor.
OSFP 1.6T AEC (Active Electrical Cable)
- Industry Standard - Up to 1600 Gbps aggregate throughput, compliant to IEEE 802.3ck .
- Low Power – Lower power compared to optics; targeting <20W per module.
- Active cables optimized for heat dissipation and system airflow.
OSFP 1.6T ACC (Active Copper Cable)
- Industry Standard – Up to 1600 Gbps aggregate throughput, compliant to IEEE 802.3df specification.
- Low Power/Low Latency – Extending the reach of copper with linear active amplification.
- Increased Routability – Maintaining reach with fine copper wire.
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OSFP 112G Cages and Connectors
TE’s new OSFP 112G cages and connectors add to the wide range of products in the existing OSFP product portfolio providing customers with an 8x112G interconnect solution to support data transfer in next generation high density data center and cloud computing.
Product Features
OSFP connectors, cages, and cable assemblies
- Support aggregate data rates of 200 Gbps (8 x 28G NRZ) and up to 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4
- Superior thermal and signal-integrity performance
- High port density
- Designed for up to 15W thermal loads with low airflow
- Optimized for front-to-back and back-to-front airflow
- Fit up to 36 ports of an 8-lane interface in a 1RU switch form factor
- Connector has proven .6mm pitch, 60 contacts total
Our Octal Small Form Factor Pluggable (OSFP) connectors, cages and cable assemblies address next-generation data center needs by supporting aggregate data rates up to 400 Gbps. These products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. By utilizing integrated thermal heatsink technology in the plug, OSFP products provide superior thermal performance and the signal integrity needed to support 400G data rates. OSFP products offer high port density and can fit up to 36 ports of an 8-lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps.
Product Specifications
OSFP connectors, cages, and cable assemblies
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1x1 Cage
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1x4 Cage
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SMT Connector
Shop OSFP Parts
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OSFP to OSFP
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OSFP to 2 QSFP
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OSFP to 4 QSFP
Cable Assembly Information
- OSFP to OSFP straight cables
- OSFP to 2 or 4 QSFP56 breakout cables
- OSFP to 8 SFP56 breakout cables
- Other custom cable configurations will be considered
- Up to 26 AWG supported in the OSFP form factor
- Maximum cable reach of 3 meters meets IEEE 802.3cd SDD21 requirement of -17.16 dB at 13.28 GHz