2.54 mm rugged board-to-board solutions

AMPMODU Mod II & IV family offers a variety of rugged and reliable board-mount connectors on a .100" x .100" (2.54 x 2.54 mm) centerline configuration with headers utilizing .025" square posts. These connectors have a 3.0 A max current rating. Variants include single row and double row layouts with through-hole, press fit (available for headers only), and surface mount termination styles, vertical and right angle orientations, and various plating options.

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Features

Broad portfolio:

  • Single & double row, through hole (TH), surface mount (SMT) & press fit (headers only), vertical & horizontal, various plating options, tube & tape & reel, tin & tin-lead on tails, standard & low profile.

 

Stand-offs on housings:

  • Allow for easy solder flux cleaning.

 

Closed entry housings on receptacles:

  • Provide lead-in ramp for positive mating.
  • Significantly eliminate the possibility of post stubbing.

 

Dual entry receptacle variant:

  • Offers greater flexibility in board assembly.

 

High-temp resin variants:

  • Reflow solderable.
  • Saving time and money through shared manufacturing processes.

 

Headers are available as standard unshrouded, breakaway, reeled breakaway, shrouded, action pin, and stacking types:

  • Offering great flexibility in design architecture.
PDF - English
Selection Guide - AMPMODU Headers
PDF - English
Design Navigator - Board Signal interconnects

Typical Applications

  • Industrial controls
  • Building and home automation devices
  • Servo drives
  • Programmable logic controllers (PLCs) and other I/O devices
  • Machinery
  • Telecommunications equipment
  • Robotics
  • Instrumentation and test equipment
  • Medical equipment
AMPMODU Interconnect System

Product Group

AMPMODU Interconnect System

A comprehensive family of modular signal interconnects for board-to-board, wire-to-board, and wire-to-wire applications from 1.00 mm (0.039”) to 3.96 mm (0.156”) centerlines that are widely used across nearly all Industrial applications requiring PCBs.
Get to know the AMPMODU interconnect system family

Product Group

AMPMODU System 50

AMPMODU System 50 includes a wide variety of high density board-to-board and cable-to-board connectors that offer high quality and safety.

Product Group

Ampmodu 50/50 grid

AMPMODU 50/50 Grid includes a variety of high density board-to-board and cable-to-board connectors with a .050 x .050 (1.27 x 1.27mm) pitch

Product Group

AMPMODU MTE

AMPMODU MTE includes a variety of wire-to-board and wire-to-wire connectors available in IDC and crimp termination types.
Get to know the AMPMODU interconnect system family

Product Group

AMPMODU Mod IV V

AMPMODU Mod IV & V includes a variety of rugged and reliable wire-to-board connectors on a modular .100" x .100" (2.54 x 2.54mm) centerline configuration.