Reduce, Limit, and Control EMI
With the growing demand for thinner devices with multiple antennas, higher data rates, and increased operating frequencies, modern mobile devices require better solutions for reducing or limiting the effect of electromagnetic interference (EMI). Board level shields from TE are stamped one-piece and two-piece metal cages that help provide isolation of board level components, minimize crosstalk, and reduce EMI susceptibility, all without impacting system speed.
Product Features
Board Level Shielding
- Two-piece solution (minimum 0.85mm height)
- One-piece solution (minimum 0.7mm height)
- Standardized materials and thicknesses
- Use of standardized features includes: corner shape, carrier attachment, SMT (castellations), bending radii, pick and place features, through holes, locking holes, locking and contact dimples
Improved Thermal Conductivity: Aluminum covers provide up to 5 times better heat dissipation than CRS.
EMI Performance: Aluminum material offers similar EMI suppression to CRS material.
Select Applications
Board Level Shielding
- Phones
- Tablets
- Wearables
- Consumer electronics
- The Internet of Things
- Point of sale equipment
- Commercial & enterprise routers
As mobile device complexity and functionality increases, there is a growing need for thinner devices with multiple antennas, higher data rates, and increased operating frequencies. EMI shields from TE are stamped one- and two-piece metal cages that help provide isolation of board level components, minimize crosstalk, and reduce EMI susceptibility without impacting system speed.
Material Comparison
CRS vs. Aluminum
We also offer custom solutions in galvanized steel, stainless steel, and nickel silver C770.
| CRS 1008/1010 | Plated Aluminum | |
|---|---|---|
| Finish | Pre-plated tin | Cu/Al |
| Solderability | Good | Good |
| Corrosion Resistance | Fair | OK |
| Aesthetic | Fair | Good |
| Thermal Conductivity | 50 W/m-K | 120-250 W/m-K |
| Density | 7850 kg/m3 | 2710 kg/m3 |
Standard BLS Portfolio
Minimize Crosstalk
Our standard portfolio of board level shieldsing is tooled and in-stock so that you can quickly get the parts you need to minimize crosstalk and reduce EMI susceptibility in your application. In addition to cold rolled steel (CRS) material, our standard portfolio includes aluminum material options, which are 1/3 the density of CRS. This offers extreme weight savings, while still offering similar EMI suppression. Aluminum options also provide up to 5 times better heat dissipation than CRS material.
BLS Options
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On-demand standard portfolio.
Our new standard portfolio of BLS is available on-demand. Explore our sizes and offering to improve your speed to market.
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Custom shielding designs.
Get exactly what you need. Strike up the conversation with our experts by completing this form.
In response to the growing demand for IoT designs, ever thinner and lighter devices, and quicker design turnaround times, TE Connectivity introduces a new standard portfolio of Board Level Shields (or BLS) with the ability to minimize crosstalk and reduce electromagnetic susceptibility.
With BLS, we are able to leverage TE core competencies of high-speed stamping and automation into customer benefits that allow faster time-to-market and volume, at competitive prices.
- Eric Powell,
- Product Manager
Board Level Shielding (BLS) is manufactured in our Qingdao Plant. BLS is made in one continuous, fully automated line where the product is first stamped, 100% inspected, and packaged for shipment.
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Slim Solutions (English)
TE Advantage
- Complex? Custom? High volume? No problem.
- Extensive experience in EMI, stamping, plating, and automation
- Globally deployed field application engineers (FAE) for local support
- Streamlined, automated, and continuous production line
- Most custom parts available 3-5 days from design freeze
- Benefits from global scale and low cost manufacturing
